According to Apple analyst Ming-Chi Kuo, the upcoming iPhone 15 lineup from Apple will utilize an updated version of the company’s Ultra-Wideband (UWB) chip. This chip is expected to enhance integration with Apple’s forthcoming mixed-reality headset, Vision Pro.
Since the iPhone 11, Apple has been incorporating UWB chipsets in its smartphones. The new version, reportedly named U2, will undergo a transition to a 7nm process, resulting in improved performance and efficiency.
The UWB chipset has been instrumental in enabling various features on previous iPhones, including Handoff for seamless work transitions across Apple devices, Precision Finding, and AirDrop.
The primary objective of the updated chipset is to enable deeper integration with Apple’s Vision Pro headset, as the company aims to establish a robust hardware ecosystem.
Looking ahead, Apple’s iPhone 16 is expected to adopt the Wi-Fi 7 standard, offering an enhanced set of features for Apple devices operating on the same local network.
Leaked information suggests that the iPhone 15 will not feature a major design overhaul but will instead focus on refinements such as thinner bezels compared to the iPhone 14 and rounded corners in comparison to its predecessor.
Furthermore, the iPhone 15 is anticipated to be the first iPhone model to incorporate a USB Type-C port, in compliance with regulations imposed by several regions.